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| E-pHEMT MMIC Product Features * 50 ~ 6000MHz * GaAs E-pHEMT MMIC * Higher linearity * Low Noise Figure * High Max input power * SOT-89 SMD Type package * Higher productivity * Lower manufacturing cost * Pb Free / RoHS Standard AE362 (Preliminary) Application * Cellular, GSM * PCS, W-CDMA * Wibro, WiMax Package : SOT-89 Description AE362 is a drive or pre-drive amplifier designed in a low cost SOT-89 package. This MMIC is based on Gallium Arsenide Enhancement Mode pHEMT which shows low current and high IP3. It is designed as driver devices for infrastructure equipment in the 50~6000MHz Wireless technologies such as Cellular, GSM, PCS, W-CDMA, Wibro, WiMax System. The data in this spec sheet is valid only for 50 ohm application. Specifications PARAMETER Frequency Range Gain Input Return Loss Output Return Loss Output IP3 1dB Compression Point W-CDMA Power (4FA) Noise Figure DC Current Supply Voltage NOTE 1. Test conditions unless otherwise noted. Freq=1900~2200MHz, Vdd=+4.5V, Ta=25, 50 system 2. OIP3 measured with 2 tones at an output power of +0dBm/tone separated by 1MHz 3. Test Model 1, 64DPCH, 3.84MHz BW, @5MHz and 10MHz offset UNIT MHz dB dB dB dBm dBm dBm dB mA V MIN TYP 50 ~ 6000 15.5 -13 -12 MAX Remark 29 18 32 21 8.5 1.3 45 4.5 1.8 Absolute Minimum and Maximum Ratings PARAMETER Device Voltage Operating Temperature Storage Temperature UNIT V -40 -40 MIN TYP +5 MAX +6 +85 +150 Tel : 82-31-250-5011 rfsales@rfhic.com All specifications may change without notice. Version 0.3 E-pHEMT MMIC AE362 (Preliminary) Application Circuit: 800MHz ~ 900MHz, 50ohm System Typical RF Performance: VDD=4.5V, IDS=45mA, TA=25, 50ohm System S-parameter 25 20 Noise Figure vs Frequency 3.0 2.5 2.0 20 S21 10 Gain(dB) 15 0 1.5 10 -10 1.0 5 S22 0.75 0.80 0.85 Freq(GHz) 0.90 -20 S11 0.95 -30 1.00 0.5 0.0 800 820 840 860 Freq(MHz) 0 0.70 880 900 OIP3 vs Frequency 36.0 34.0 32.0 30.0 28.0 26.0 800 820 840 860 880 900 Freq(MHz) 24.0 22.0 20.0 18.0 16.0 14.0 800 820 P1dB vs Frequency 840 860 880 900 Freq(MHz) Tel : 82-31-250-5011 rfsales@rfhic.com All specifications may change without notice. Version 0.3 E-pHEMT MMIC AE362 (Preliminary) Application Circuit: 1900MHz ~ 2200MHz, 50ohm System Typical RF Performance: VDD=4.5V, IDS=45mA, TA=25, 50ohm System S-parameter 30 20 10 0 -10 -20 -30 1.8 3.00 2.50 S21 S11 S22 Noise Figure vs Frequency 2.00 1.50 1.00 0.50 0.00 1900 1.9 2.0 2.1 freq, GHz 2.2 2.3 1940 1980 2020 2060 2100 2140 2180 Freq(MHz) 36.0 34.0 32.0 30.0 28.0 26.0 1900 OIP3 vs Frequency 24.0 22.0 20.0 18.0 16.0 14.0 1900 P1dB vs Frequency 1940 1980 2020 2060 2100 2140 2180 1940 1980 2020 2060 2100 2140 2180 Freq(MHz) Freq(MHz) Tel : 82-31-250-5011 rfsales@rfhic.com All specifications may change without notice. Version 0.3 E-pHEMT MMIC AE362 (Preliminary) Application Circuit: 2400MHz ~ 2600MHz, 50ohm System Typical RF Performance: VDD=4.5V, IDS=45mA, TA=25, 50ohm System 30 20 10 0 -10 -20 -30 2.3 2.4 2.5 2.6 2.7 S21 S11 S22 S - parameter 3.0 2.5 2.0 1.5 1.0 0.5 0.0 2400 Noise Figure vs Frequency 2440 2480 2520 2560 2600 freq, GHz Freq(MHz) OIP3 vs Frequency 36.0 34.0 32.0 30.0 28.0 26.0 2400 2440 2480 2520 2560 2600 24.0 22.0 20.0 18.0 16.0 14.0 P1dB vs Frequency 2400 2440 2480 2520 2560 2600 Freq(MHz) Freq(MHz) Tel : 82-31-250-5011 rfsales@rfhic.com All specifications may change without notice. Version 0.3 E-pHEMT MMIC ESD Protection AE362 (Preliminary) For a safe use in all situations, it is recommended to have proper ESD control techniques while the device is being handled. Here are some recommended precautions; - Person at a workbench should be earthed via a wrist strap and a resistor. - All mains-powered equipment should be connected to the mains via an earth-leakage switch. - Equipment cases should be grounded. - Relative humidity should be maintained between 40% and 50%. - An ionizer is recommended. - Keep static materials, such as plastic envelopes and plastic trays etc. away from the workbench Dimensions Pin No 1 2 3 4 Function Input Ground Output/Bias Ground PCB Pad Layout Recommended Mounting Configuration Mounting Configuration Notes 1.Ground / thermal via holes are critical for the proper performance of this device. 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via hole region contacts the heatsink. 4. Do not put solder mask on the backside of the PCB in the region where the board contacts the heatsink. 5. RF trace width depends upon the PCB material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters. RFHIC Corporation (RFHIC) reserves the right to make changes to any products herein or to discontinue any product at any time without notice. RFHIC do not assume any liability for the suitability of its products for any particular purpose, and disclaims any and all liability, including without limitation consequential or incidental damages. The product specifications herein expressed have been carefully checked and are assumed to be reliable. However, RFHIC disclaims liability for inaccuracies and strongly recommends buyers to verify that the information they are using is current before placing purchase orders. RFHIC products are not intended for use in life support equipment or application where malfunction of the product can be expected to result in personal injury or death. Buyer uses or sells such products for any such unintended or unauthorized application, buyer shall indemnify, protect and hold RFHIC and its directors, officers, stockholders, employees, representatives and distributors harmless against any and all claims arising out of such use. RFHIC's liability under or arising out of damages, claims of whatsoever kind and nature which RFHIC products could cause shall be limited in amount to the net purchase price of the products sold to buyer by RFHIC. Tel : 82-31-250-5011 rfsales@rfhic.com All specifications may change without notice. Version 0.3 |
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